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Unlocking the Full Potential of Soft IP (Webinar) Contemporary system-on-chip (SoC) designs are using more legacy and third-party IP than ever before. The deployment of soft, or synthesizable IP is on the rise as well, due to the opportunity for customization and easier process migration. But how can you be sure about the quality of your chosen soft IP deliverables? By its very nature, soft IP’s configurability creates a daunting challenge with regard to the assessment of completeness and robustness. TSMC, along with its IP Partners and Atrenta, is helping to tame these problems. In this webinar, we’ll discuss TSMC’s Soft IP Alliance program, how it is implemented and discuss practical results, presented by a member of the program. |
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Agenda:
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When: Tuesday, March 5, 2013 Anyone who is contemplating the use of soft IP for their next SoC project should attend this webinar |
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About the Speakers
Daniel has worked in Silicon Valley for the past 28 years with computer manufacturers, electronic design automation software, and semiconductor intellectual property companies. Currently Daniel is a Strategic Foundry Relationship Expert for companies wishing to partner with TSMC, UMC, SMIC, Global Foundries, and their top customers. Daniel’s latest passion is the Semiconductor Wiki Project (www.SemiWiki.com). |
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John joined Sonics in 2010, working on System IP, leveraging his expertise in the efficient implementation of system architecture. Prior to that John spent 7 years as a founder and the Chief Technology Officer at Silistix commercializing NoC architectures based upon a breakthrough synthesis technology that generated self-timed on-chip interconnect networks. Prior to founding Silistix, John was a research fellow in the Department of Computer Science at the University of Manchester, UK where he received his PhD in 2000 for work on Asynchronous System-on-Chip Interconnect. |
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Mike Gianfagna's career spans 3 decades in semiconductor and EDA. Most recently, Mike was vice president of Design Business at Brion Technologies, an ASML company. Prior to that, he was president and CEO for Aprio Technologies, a venture funded design for manufacturability company. Prior to Aprio, Mike was vice president of marketing for eSilicon Corporation, a leading custom chip provider. Mike has also held senior executive positions at Cadence Design Systems and Zycad Corporation. His career began at RCA Solid State, where he was part of the team that launched the company's ASIC business in the early 1980's. He has also held senior management positions at General Electric and Harris Semiconductor (now Intersil). Mike holds a BS/EE from New York University and an MS/EE from Rutgers University. |
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Dan is responsible for overall IP marketing
as well as managing the company IP Alliance partner program. Dan holds a Bachelor of Science degree in electrical engineering from UC Santa Barbara, a Master of Science in computer engineering, and an MBA from Santa Clara University. |
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