SAN JOSE, Calif and HSINCHU, Taiwan, R.O.C. — Oct 31, 2012 — Atrenta Inc., the leading provider of SoC Realization solutions for the semiconductor
and consumer electronics industries, with TSMC announced
today the planned availability of IP Kit 2.0. Based on the SpyGlass® RTL design platform, IP Kit is a fundamental
element of TSMC’s soft IP9000 Quality Assessment program that assesses
the robustness and completeness of soft, or synthesizable IP. IP Kit 2.0
has undergone extensive beta testing by TSMC soft IP alliance partners: Digital
Media Professionals Inc., Dolphin Integration, Sonics,
Inc. and Vivante Corporation. IP Kit 2.0 will be fully supported
on TSMC-Online and available to all TSMC’s
soft IP alliance partners on Nov. 20, 2012.
on May 26, 2011, TSMC’s soft IP quality assessment
program is a joint effort between TSMC and Atrenta to deploy a series of SpyGlass
checks that create detailed reports of the completeness and robustness of soft
IP. Currently, over 15 soft IP suppliers have been qualified through the program.
IP Kit 2.0 represents an enhanced set of checks that adds physical implementation
data (e.g., area, timing and congestion) and advanced formal lint checks (e.g.,
X-assignment, dead code detection). IP Kit 2.0 also allows easier integration
into the end user’s design flow and enhanced IP packaging options.
“The predictability of soft IP reuse continues to be a challenge for the
SoC design community,” said Mike Gianfagna, vice president of corporate
marketing at Atrenta. “Thanks to TSMC’s commitment to drive the
quality of soft IP deliverables, we are making real progress toward improving
The soft IP9000 program has already had a positive impact on the delivered
quality of soft IP for TSMC’s customers. The addition of physical
implementation information and formal lint analysis will further enhance
the effectiveness of
the program,” said Suk Lee, senior director, Design Infrastructure
Marketing Division at TSMC. “The beta test program went very smoothly.
IP Kit 2.0 installed easily and ran with minimal issues during the beta test
our selected soft IP alliance partners.”
IP Kit 2.0 is available from
Atrenta. Admission into the soft IP qualification program is managed by TSMC.
Contact Richard Lee (email@example.com) for
further information on the program.
More information about the soft IP alliance
partners who participated in the beta test program for IP Kit 2.0 is available
on the accompanying sheet.
Atrenta’s SpyGlass® Predictive Analysis software platform significantly
improves design efficiency for the world’s leading semiconductor and consumer
electronics companies. Patented solutions provide early design insight into the
demanding performance, power and area requirements of the complex system on chips
(SoCs) fueling today’s consumer electronics revolution. More than two
hundred companies and thousands of design engineers worldwide rely on SpyGlass
risk and cost before traditional EDA tools are deployed. SpyGlass functions
like an interactive guidance system for design engineers and managers, finding
fastest and least expensive path to implementation for complex SoCs.
from Atrenta: Insight. Efficiency. Confidence. www.atrenta.com
© 2012 Atrenta Inc. All rights reserved. Atrenta, the Atrenta logo, and
SpyGlass are registered trademarks of Atrenta Inc. All others are the property
This press release contains forward-looking statements.
Atrenta disclaims any obligation and does not undertake to update or revise
statements in this press release.
Digital Media Professionals Inc.
“ DMP's proven track record for delivering the best quality IP to TSMC's
customers is further strengthened by becoming a selected partner participating
in IP Kit 2.0 beta testing. Having met this stringent criteria, DMP demonstrates
it can deliver 3D/2D graphics IP which is not only cost effective and
high performance, but also reliable and easy to integrate into customers'
Tatsuo Yamamoto, President & CEO, Digital Media Professionals Inc.
" After our cooperation with TSMC for the qualification of our libraries
and mixed-signal IPs, Dolphin Integration has been pleased to join the
TSMC soft IP quality assessment program as a beta tester. It was a new
step in the strong guarantee of our microcontrollers. Indeed, the combination
of SpyGlass and TSMC quality goals for the verification of our designs
proves their robustness. Our customers are thus ensured of the easiest
integration of the Flip80x51 family."
Olivier Montfort, Microcontroller Development Manager, Dolphin Integration
With more than two billion chips using Sonics IP in the market today,
we understand the importance of providing customers with the highest
quality IP that meets the rigorous standards of SpyGlass IP Kit 2.0,” said
Frank Ferro, director of product marketing, Sonics. “Today’s
SoC designers have to evaluate an incredible amount of IP and with
Sonics System IP, including our advanced on-chip networks, we help
complexity. We are thrilled to have been selected by Atrenta and
TSMC to be a beta partner and look forward to strengthening our relationship
by enhancing soft IP quality together.”
Frank Ferro, Director of Product Marketing, Sonics
Vivante is pleased to be a lead partner in Atrenta and TSMC’s SpyGlass
IP Kit 2.0 platform for soft IP quality assessment. As a global leader
in GPU and OpenCL™ technologies, we need to ensure our designs
meet stringent quality and reliability standards required by the world’s
top SoC companies. By going through extensive validation of our IP
on the SpyGlass platform, customers can be confident that selecting
products meet those goals and minimize risk in the product lifecycle
of their designs.”
Wei-Jin Dai, President and CEO, Vivante Corporation
For more information, contact: